This is the CBAR website as of c.2009. The CBAR program has been completed. Please see the Manufacturing Research Center (MARC) website ( for ongoing related work and further updates about this CBAR website.

The Center for Board Assembly Research (CBAR)

Today, more and more companies are optimizing their processes and systems by leveraging the breakthrough results of the CBAR research program. CBAR’s primary advanced research areas include:

  • Assembly Materials Development: Electrically conductive adhesives, no-flow reworkable underfils, lead-free solders, substrate surface finish, and materials reliability.
  • Process Technology Development: Flip Chip process technology, advanced Surface Mount Technology (SMT) processes, advanced interconnect technology and processing, photonics interconnects, process modeling and simulation, assembly processing and tooling for flexible board assembly, placement equipment characterization, environmentally conscious manufacturing -including lead-free solder process and rework development, and process reliability.
  • Production & Manufacturing Systems: Process optimization, equipment interfacing and communications, precision motion control, intelligent monitoring and diagnostics based on machine variables and post-process measurements, preventive maintenance, data-driven process control based on in-line post-process measurements, web-based monitoring, SMT line optimization, virtual equipment and SMT line modeling for assembly process proto-typing, and lifecycle information management.
  • Automated Optical Inspection: Object recognition, processing of AOI imagery, and defect detection and identification.
  • Roadmapping & Standards: CBAR researchers actively participate in Industry Roadmapping and Standards Development through the IPC, NEMI, MESA, and RosettaNet.Through these organizations, CBAR has led activities in the area of factory information and optical systems and serves as the ‘test bed’ for the
    IPC-2500 series standards.
  • Factory Information Systems: Frameworks for machine and application communication, Enterprise Resource Planning (ERP), Manufacturing Execution Systems (MES), Product Life-cycle Management, New Product Introduction (NPI), and Enterprise to Enterprise communication via RosettaNet Pips. In addition, information flow from materials purchase through build points to as-built configurations, and warranty service repair. Also, supply
    chain management and data exchange convergence.

Please contact us if you have any questions or to receive further information.